To solve such a problem that it is difficult to simply mass-produce an LED light-emitting device having excellent light emission efficiency and light emission characteristics (one binned) in a conventional production method of the LED light-emitting device.

The LED light-emitting device 10 is formed by mounting LEDs 3 on a circuit board 2, forming a light scattering layer 7 on side surfaces of the LEDs 3, and forming a phosphor layer 5a on the upper surfaces of the LEDs 3 and the light scattering layer 7. The upper surfaces of the LEDs 3 and the upper surface of the light scattering layer 7 form almost the same surface.