Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP5158472
Kind Code:
B2
Abstract:
A light emitting apparatus with a combination of a plurality of LED chips (102) and a phosphor layer (103) is provided to significantly reduce variations in chromaticity and luminance. The plurality of semiconductor light emitting devices (LED chips 102) are disposed with a gap (L) therebetween, and the phosphor layer (103) is formed on the upper surface thereof to bridge over the gaps between the LED chips (102). The phosphor layer (103) may be uniform in thickness, but preferably less in thickness over the gaps between the LED chips (102) than on the upper surface of the LED chips (102). The phosphor layer (103) is continuously formed on the upper surface of the array of the chips (102) with no phosphor layer (103) present in between the chips (102). This allows for reducing variations in luminance and chromaticity which may result from the gaps or the phosphor layer (103) present in between the gaps.
Inventors:
Shuichi Aki
Yasuyuki Kawakami
Tsutomu Akagi
Mitsunori Harada
Yasuyuki Kawakami
Tsutomu Akagi
Mitsunori Harada
Application Number:
JP2007138213A
Publication Date:
March 06, 2013
Filing Date:
May 24, 2007
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L33/50; H01L33/52; H01L33/56; H01L33/62
Domestic Patent References:
| JP2005079202A | ||||
| JP2004172578A | ||||
| JP2000022222A | ||||
| JP2005252222A |
Attorney, Agent or Firm:
Kimiko Tada
Miyagawa Keizo
Miyagawa Keizo