Title:
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003152045
Kind Code:
A
Abstract:
To omit waste in manufacturing and to reduce the cost by manufacturing in response to the quality distribution within a semiconductor wafer surface.
The semiconductor manufacturing apparatus divides the semiconductor wafer 1 into a plurality of areas in response to the degree of the quality distribution of the semiconductor wafer surface to be expected, inspects it area by area, and decides the area to dispose based on the inspected result or the like.
Inventors:
NAKAMURA MASAHARU
SHIMIZU TAKESHI
IKEDA HIDEMASA
SHIMIZU TAKESHI
IKEDA HIDEMASA
Application Number:
JP2001344425A
Publication Date:
May 23, 2003
Filing Date:
November 09, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
RYODEN SEMICONDUCTOR SYST ENG
RYODEN SEMICONDUCTOR SYST ENG
International Classes:
H01L21/66; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Keigo Murakami (3 outside)