Title:
SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2018037161
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of extending service life of a heater at a low cost.SOLUTION: A semiconductor substrate is processed in a reactor. A heater is arranged around the reactor and heats the reactor. The heater includes: a spiral-shaped resistance heating element 3; an electrode 4 for supplying electric power to the resistance heating element 3; and a heat insulation material 5 surrounding the resistance heating element. The electrode 4 is fixed to the resistance heating element 3 in the inside of the heat insulation material 5, pulled out to the outside of the heat insulation material 5 while passing through an opening provided on the side surface of the heat insulation material 5, and is not fixed to the heat insulation material 5.SELECTED DRAWING: Figure 3
Inventors:
UDA YUKIO
INOUE KAZUYA
RYU HIROSHI
KANADA KAZUNORI
INOUE KAZUYA
RYU HIROSHI
KANADA KAZUNORI
Application Number:
JP2016167112A
Publication Date:
March 08, 2018
Filing Date:
August 29, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05B3/03; F27D11/02
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno