Title:
SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP3854157
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve throughput in a semiconductor manufacturing apparatus including a plurality of film forming chambers by performing cleaning treatment without making other film forming chambers wait while one detoxifying apparatus is used.
SOLUTION: The semiconductor manufacturing apparatus comprises a plurality of chambers 1, 2, etc. Exhaust lines 31, 32 of the chamber 1, 2 are respectively connected to one unit of a detoxifying apparatus 20. When either of chambers 1, 2 has entered the timing of cleaning, the cleaning treatment is performed to the chamber 1 which has entered the timing of cleaning and the other chamber 2.
Inventors:
Masanori Okuno
Application Number:
JP2002006297A
Publication Date:
December 06, 2006
Filing Date:
January 15, 2002
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
C23C16/44; H01L21/205; (IPC1-7): H01L21/205; C23C16/44
Domestic Patent References:
| JP11008200A | ||||
| JP11033345A |
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono
Aniya Setsuo
Hitoshi Kiyono
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