Title:
SEMICONDUCTOR MANUFACTURING DEVICE AND STATIC ELECTRICITY REMOVING METHOD
Document Type and Number:
Japanese Patent JP3464177
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor manufacture device provided with a function of removing static electricity from the surface of a wafer and to provide a method for removing static electricity from the surface of the wafer.
SOLUTION: The semiconductor manufacture device 10 is provided with a wafer-supporting part 14 for supporting a wafer 16, and the atmosphere around the wafer-supporting part 14 is set to have fluidity in a constant direction. An ion-generation part 18 generating ions in the atmosphere is installed. The ions generated from the ion generation part 18 reach the surface 16a of the wafer 16 supported by the wafer supporting part 14.
Inventors:
Akihiro Sonoda
Application Number:
JP25171999A
Publication Date:
November 05, 2003
Filing Date:
September 06, 1999
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/027; G03F7/16; G03F7/38; H01L21/00; H01L21/02; (IPC1-7): H01L21/027; H01L21/02
Domestic Patent References:
| JP2148827A | ||||
| JP529296A | ||||
| JP547650A |
Attorney, Agent or Firm:
Takashi Ogaki