Title:
SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JPH03152952
Kind Code:
A
Abstract:
PURPOSE: To prevent cracks from occurring in an adhesive sheet on which semiconductor elements are mounted by a method wherein an extension ring, whose surface is partially roughened so as to prevent the adhesive sheet from slipping when it is extended, is provided.
CONSTITUTION: An adhesive sheet slips easily on a smooth part 9b and hardly slips on a roughened part 9a of an expansion ring 4 in contact with an adhesive sheet. Therefore, in this case, the adhesive sheet is harder to extend in an X direction as compared with in a Y direction, and if the adhesive sheet is extended in a Y direction, it is hard to extend in an X direction, so that the adhesive sheet is prevented from being extended so much as to make cracks induced in it.
Inventors:
ICHISE MASAHIKO
Application Number:
JP29273989A
Publication Date:
June 28, 1991
Filing Date:
November 09, 1989
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/67; H01L21/68; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)