PURPOSE: To provide a semiconductor manufacturing device, which prevents a lead frame from being contaminated and is capable of heating the whole lead frame uniformly, rapidly and efficiently.

CONSTITUTION: A semiconductor manufacturing device is mounted with a gas spraying means 5, a feed pipe 7, which is introduced into an exhaust tube 8 to feed the air (gas) 4, and a first heater 9 for heating the air 4 and is mounted with a first heat unit 6 formed with a gas injection part 10 consisting of a plurality of tabular materials 11 provided openly with a multitude of stirring holes 11a and a second heater 12 for heating a lead frame 3. Moreover, the device is provided with a second heat unit 14, which is positioned on a die pad and is formed with a suction hole 13, air spraying nozzles 17 for spraying the air 4 from the width direction of the frame 3 and a third heater 18 for heating the frame 3 and has a frame transfer means 15, which moves this heater 18 while making the heater 18 position on the unit 14, and the tube 8 to exhaust the sucked air 4.