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Title:
SEMICONDUCTOR MANUFACTURING DEVICE, MEASURING DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2022037423
Kind Code:
A
Abstract:
To provide, as technology capable of processing a wafer as predetermined and also inspecting a state of the wafer processed as predetermined, a semiconductor manufacturing device that is higher in convenience than before and can be embodied with relatively simple constitution.SOLUTION: A semiconductor manufacturing device comprises: a processing device which processes a wafer in a processing chamber as predetermined; a housing which forms a carrying chamber; a carrying mechanism which is arranged in the carrying chamber, and carries the wafer; a plurality of load ports which are fitted to the housing forming the carrying chamber; a carrying container which is fitted at least one of the plurality of load ports detachably in an airtight state; and a measuring device 25 which comprises a measuring instrument 35 arranged in a measurement chamber 26a, is fitted to a load port 10d different from the load port fitted with the carrying container detachably in an airtight state, and measures a state of the wafer having been processed as predetermined. The carrying mechanism carries the wafer, carried out from the carrying container, into the processing chamber, carries out the wafer processed as predetermined from the processing chamber, and carries it into the measurement chamber 26a.SELECTED DRAWING: Figure 12

Inventors:
HORIE MASAHIRO
Application Number:
JP2020141552A
Publication Date:
March 09, 2022
Filing Date:
August 25, 2020
Export Citation:
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Assignee:
SHASHIN KAGAKU CO LTD
International Classes:
H01L21/677; H01L21/66
Domestic Patent References:
JP2010056108A2010-03-11
JP2014241333A2014-12-25
JPH01230233A1989-09-13
Foreign References:
US20030193671A12003-10-16
US7187994B12007-03-06
US20030015674A12003-01-23
US20020152808A12002-10-24
Attorney, Agent or Firm:
Patent business corporation r&c