Title:
半導体製造装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7326861
Kind Code:
B2
Abstract:
By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.
Inventors:
Masato Negishi
Kazuo Yoshida
Kazuo Yoshida
Application Number:
JP2019093831A
Publication Date:
August 16, 2023
Filing Date:
May 17, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/301; H01L21/67
Domestic Patent References:
| JP2016195194A | ||||
| JP2007194571A | ||||
| JP2009117867A | ||||
| JP2009238881A | ||||
| JP2002141392A | ||||
| JP2012119641A |
Attorney, Agent or Firm:
Patent Attorney Takada / Takahashi International Patent Office