Title:
半導体製造装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7381370
Kind Code:
B2
Abstract:
In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, and a pipe configured to supply the container with liquid to treat the substrate. The apparatus further includes an ejector including a first passage where the liquid introduced from the pipe and the liquid introduced from the container are joined and pass through, and a first opening configured to eject the liquid that has passed through the first passage. Furthermore, the first passage has an area where a sectional area of the first passage becomes large as advancing downstream in the liquid.
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Inventors:
Katsuhiro Sato
Hiroshi Fujita
Yoshinori Kitamura
Satoshi Nakaoka
Tomohiko Sugita
Hiroshi Fujita
Yoshinori Kitamura
Satoshi Nakaoka
Tomohiko Sugita
Application Number:
JP2020037948A
Publication Date:
November 15, 2023
Filing Date:
March 05, 2020
Export Citation:
Assignee:
Kioxia Corporation
International Classes:
H01L21/306
Domestic Patent References:
| JP2019094526A | ||||
| JP2019220560A | ||||
| JP2018160506A | ||||
| JP2012015490A | ||||
| JP2009081248A | ||||
| JP2004057873A | ||||
| JP2002001386A | ||||
| JP11290801A | ||||
| JP2003530989A |
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Akira Akaoka
Suguru Yamanoi
Satoru Asakura
Takeshi Sekine
Akira Akaoka
Suguru Yamanoi