Title:
SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2023100167
Kind Code:
A
Abstract:
To irradiate a semiconductor chip with uniform, clear, and sharp light from an illumination device.SOLUTION: A suction nozzle 11 of a semiconductor manufacturing device 10 has a suction nozzle body 12 and a wafer sheet abutting surface 13 positioned on a side of a wafer sheet 2 on which a semiconductor chip 1 is mounted. An opening 13A is provided on the wafer sheet abutting surface 13, and a plurality of optical fiber 25 for irradiating the semiconductor chip 1 with light through the opening 13A are provided in the suction nozzle body 12.SELECTED DRAWING: Figure 2
Inventors:
KOJIMA TOMOYUKI
KODAIRA AKIHISA
KODAIRA AKIHISA
Application Number:
JP2022000656A
Publication Date:
July 18, 2023
Filing Date:
January 05, 2022
Export Citation:
Assignee:
TOKYO WELD CO LTD
International Classes:
H01L21/67; H01L21/52
Attorney, Agent or Firm:
Yukitaka Nakamura
Manabu Miyajima
Yukihiro Hotta
Hiroyuki Nagai
Manabu Miyajima
Yukihiro Hotta
Hiroyuki Nagai