Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP6711210
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of extending service life of a heater at a low cost.SOLUTION: A semiconductor substrate is processed in a reactor. A heater is arranged around the reactor and heats the reactor. The heater includes: a spiral-shaped resistance heating element 3; an electrode 4 for supplying electric power to the resistance heating element 3; and a heat insulation material 5 surrounding the resistance heating element. The electrode 4 is fixed to the resistance heating element 3 in the inside of the heat insulation material 5, pulled out to the outside of the heat insulation material 5 while passing through an opening provided on the side surface of the heat insulation material 5, and is not fixed to the heat insulation material 5.SELECTED DRAWING: Figure 3
More Like This:
| WO/1991/001617 | HEAT GENERATING MEMBER |
| JPH06215856 | ELECTRODE FOR FLAME PRAYING HEATING BODY |
Inventors:
Uda Yukio
Kazuya Inoue
Ryu Taishi
Kazunori Kaneda
Kazuya Inoue
Ryu Taishi
Kazunori Kaneda
Application Number:
JP2016167112A
Publication Date:
June 17, 2020
Filing Date:
August 29, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05B3/03; F27D11/02
Domestic Patent References:
| JP7253276A | ||||
| JP2009250548A | ||||
| JP2012089557A | ||||
| JP4024486A |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno