PURPOSE: To transfer a wafer between locations having different temperatures without making a mistake in carrying by a method wherein a heating mechanism is provided in a part in which a semiconductor substrate transfer robot comes into contact with a substrate.

CONSTITUTION: A carrying robot for transferring a wafer placed on a susceptor having a high temperature to a cassette comprises a wafer holder 11, a holder heat part 12, a heater 13, a heat insulating material 14, an arm part 15 and a shaft part 16. The wafer holder 11 is heated by the heater 13 and its temperature becomes close to that of the wafer. The temperature control at that time is performed as follows: For instance, the temperature of the wafer holder 11 is increased just before transferring the wafer thereto and after the wafer is placed on the holder 11, it is gradually cooled, or the temperature of the susceptor is always held close to a room temperature, or further it is heated when transferring the wafer thereto and also it is held at a room temperature when transferring the wafer within a cassette thereto. Accordingly, the mistake in carrying the wafer due to warpage caused by a temperature change of the wafer holder and wafer can be prevented.