Title:
半導体製造排ガスの処理方法及び装置
Document Type and Number:
Japanese Patent JP3893023
Kind Code:
B2
Abstract:
A process and an apparatus for treating exhaust gases, comprising an aeration stirring tank (5) employing an aqueous alkaline liquid, and a gas-liquid contact device (7) and/or a packed column (11). The apparatus can remove at a posterior stage harmful gases failed to be removed by the aeration stirring tank, for example, water-soluble organic compounds such as ethanol, halogenated silicon compounds such as SiCl4, and halogen gases such as F2 and Cl2. It is particularly suitable for purifying exhaust gases discharged from a semiconductor production device.
Inventors:
Hiroshi Ikeda
Kubota Yasuhiro
Takashi Kyotani
Kubota Yasuhiro
Takashi Kyotani
Application Number:
JP2000516759A
Publication Date:
March 14, 2007
Filing Date:
October 15, 1998
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B01D53/38; B01D53/34; B01D53/40; B01D53/68; B01D53/75; B01D53/77; B01D53/78
Domestic Patent References:
| JP7148414A | ||||
| JP3242215A | ||||
| JP8309147A | ||||
| JP8057254A | ||||
| JP8057246A | ||||
| JP60125228A | ||||
| JP51044744U |
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Tadahiko Kurita
Shurin Sakurai
Shinya Hosokawa
Minako Matsuyama
Takako Koiso
Mitsutoshi Nakamura
Shinjiro Ono
Tadahiko Kurita
Shurin Sakurai
Shinya Hosokawa
Minako Matsuyama
Takako Koiso
Mitsutoshi Nakamura