Title:
半導体の製造方法
Document Type and Number:
Japanese Patent JP4450202
Kind Code:
B2
Inventors:
Koichi Gosho
Jun Ito
Jun Ito
Application Number:
JP2004306950A
Publication Date:
April 14, 2010
Filing Date:
October 21, 2004
Export Citation:
Assignee:
Toyoda Gosei Co., Ltd.
International Classes:
H01L21/205; H01L21/203; H01L33/00; H01L33/12; H01L33/32; H01S5/323
Domestic Patent References:
| JP2002289539A | ||||
| JP2003073196A | ||||
| JP2000286202A | ||||
| JP60173829A |
Attorney, Agent or Firm:
Osamu Fujitani