Title:
SEMICONDUCTOR MANUFACTURING SYSTEM, AND PLASMA CLEANING METHOD
Document Type and Number:
Japanese Patent JPH05166759
Kind Code:
A
Abstract:
PURPOSE: To remove reaction products deposited on the reverse side of a wafer presser.
CONSTITUTION: A disklike cleaning tool 7 with a projection 7a is placed on a lower electrode 9 in a plasma chamber 3, and it is held with a wafer presser 8. Then, process gas is supplied through a port 2 to produce a plasma so that a semiconductor manufacturing system can be cleaned.
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Inventors:
KATSUTA HIROMOTO
NISHIMOTO AKIRA
WASHITANI AKIHIRO
MATSUMURA TAMIO
NISHIMOTO AKIRA
WASHITANI AKIHIRO
MATSUMURA TAMIO
Application Number:
JP35198991A
Publication Date:
July 02, 1993
Filing Date:
December 13, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Kenichi Hayase