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Title:
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME, AND MOBILE TERMINAL
Document Type and Number:
Japanese Patent JP2014082287
Kind Code:
A
Abstract:

To provide a semiconductor memory device which is a mixed chip of a volatile storage device and a nonvolatile storage device having excellent low power consumption and downsizing performance and capable of being applied to compact information equipment such as a mobile terminal.

A semiconductor memory device comprises: a first substrate 1; a DRAM part formed on the first substrate 1 and including a DRAM memory cell array (a capacitative element 8, a memory cell transistor 4, and the like) and a DRAM peripheral circuit (a transistor 3 for a peripheral circuit and the like); and a ReRAM part including a ReRAM memory cell array (a resistance change element 18, a memory cell transistor 13, and the like) and a ReRAM peripheral circuit (a transistor 2 for a peripheral circuit and the like). The ReRAM memory cell array is formed in a higher layer than the DRAM part. The DRAM peripheral circuit and the ReRAM peripheral circuit are regions on the first substrate 1, and formed in a region more peripheral than the DRAM memory cell array.


Inventors:
MIKAWA TAKUMI
SHIMAKAWA KAZUHIKO
ITO OSAMU
Application Number:
JP2012228387A
Publication Date:
May 08, 2014
Filing Date:
October 15, 2012
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H01L21/8242; H01L27/10; H01L27/105; H01L27/108; H01L45/00; H01L49/00
Attorney, Agent or Firm:
Hiromori Arai