SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS

Title:

SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2022183840

Kind Code:

A

Abstract:

To provide a semiconductor module in which the bond strength between a chip component and a solder is sufficient.SOLUTION: A semiconductor module includes a semiconductor device including a first land, a second land, and a third land, a wiring board including a substrate and a fourth land, a fifth land, and a sixth land disposed on a main surface of the substrate, a chip component including a first electrode and a second electrode disposed apart from each other in a longitudinal direction and disposed between the wiring board and the semiconductor device, a first solder bonding the first land and the fourth land, and the first electrode, a second solder bonding the second land and the fifth land, and the second electrode, and a third solder bonding the third land and the sixth land. The volume of the first solder and the volume of the second solder are larger than the volume of the third solder.SELECTED DRAWING: Figure 3

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Inventors:

HASEGAWA MITSUTOSHI
TSUBOI NORITAKE
AOKI TAKASHI

Application Number:

JP2021091341A

Publication Date:

December 13, 2022

Filing Date:

May 31, 2021

Export Citation:

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Assignee:

CANON KK

International Classes:

H01L25/00; H05K1/18; H05K3/34

Attorney, Agent or Firm:

Takuma Abe
Sougo Kuroiwa

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