Title:
SEMICONDUCTOR MODULE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2004240472
Kind Code:
A
Abstract:
To provide an easily manufacturable high-quality and high-manufacturing cost performance semiconductor module using an antenna coil mounting IC chip.
When only one turn of an antenna coil 3 constructed of a conductive material is formed on the IC chip 1 via an insulating resin layer 4 after a connection pad 2 is arranged on the upper face of the IC chip 1, both end parts of the antenna coil 3 is connected to the connection pad 2 conductively, and the upper face of these components are covered with a protection resin layer 5. In this way, the antenna coil 3 is manufactured easily, and the semiconductor module with stable quality can be obtained.
Inventors:
NOGUCHI HIDETO
ITO TATSUYA
SATO MASAKAZU
ITO TATSUYA
SATO MASAKAZU
Application Number:
JP2003025762A
Publication Date:
August 26, 2004
Filing Date:
February 03, 2003
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
G06K19/07; G06K19/077; H01Q1/38; H01Q1/40; H01Q7/00; (IPC1-7): G06K19/07; G06K19/077; H01Q1/38; H01Q1/40; H01Q7/00
Attorney, Agent or Firm:
Shigenori Ishidoya
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