Title:
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021015918
Kind Code:
A
Abstract:
To obtain a semiconductor module with high heat dissipation of heat generated by a semiconductor component.SOLUTION: A semiconductor module includes, for example, a first base portion having one surface and the other surface on the opposite side of the one surface and made of a first metal material, a second base portion having one surface and the other surface on the opposite side of the one surface, and made of a second metal material and is separated from the first base portion, a first wiring portion provided on the one surface of the first base portion via an insulating portion, a semiconductor component provided on the one surface of the second base portion via a first joint portion having higher thermal conductivity than the insulating portion, and a sealing portion that has an insulating property, is interposed between the first base portion and the second base portion, and covers the first wiring portion and the semiconductor component in a state in which the other surface of the first base portion and the other surface of the second base portion are exposed.SELECTED DRAWING: Figure 6
Inventors:
SHIRATORI YUSUKE
Application Number:
JP2019130627A
Publication Date:
February 12, 2021
Filing Date:
July 12, 2019
Export Citation:
Assignee:
AISIN SEIKI
International Classes:
H01L23/40; H01L23/36; H01L25/07; H01L25/18; H02M7/48
Attorney, Agent or Firm:
Sakai International Patent Office