Title:
SEMICONDUCTOR MODULE AND POWER CONVERTER
Document Type and Number:
Japanese Patent JP3556175
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a reliable semiconductor module which has high capability for cooling and is free of the risk of insulation breakages due to thermal stress during manufacture or operation it, and to provide a power converter using it.
SOLUTION: Conductor members 103, having channels 106 in the inside, are connected to a base plate 101 via a resin insulating layer 102, and a power semiconductor elements 104 are soldered respectively to these members 103, as the conductors of a circuit pattern. Then, the channels 106 of the respective members 103 are connected by an insulated piping 105 to make cool water flow through it. Since only soldered layers 107 exist between the elements 104 and the members 103, cooling capability is high and since there is no risk of insulation breakages to occur due to thermal stress during the manufacture or the operation, a reliable power semiconductor module is obtained.
Inventors:
Daisuke Kawase
Akira Bando
Kazuaki Sanada
Naofumi Tanie
Tomoyuki Hanio
Akira Bando
Kazuaki Sanada
Naofumi Tanie
Tomoyuki Hanio
Application Number:
JP2001067207A
Publication Date:
August 18, 2004
Filing Date:
March 09, 2001
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
F25D9/00; F25D13/00; H01L23/473; H02M1/00; H02M7/48; (IPC1-7): H01L23/473
Domestic Patent References:
| JP20017281A | ||||
| JP677368A | ||||
| JP7130925A | ||||
| JP2308558A |
Attorney, Agent or Firm:
Ichiro Suzuki
Kenjiro Take
Kenjiro Take