Title:
SEMICONDUCTOR MODULE FOR POWER
Document Type and Number:
Japanese Patent JPH1117081
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To absorb thermal distortion occurring between a metal base and a thermal buffer board with soft solder and to prevent the damage of a ceramic board by providing the metal thermal buffer board of a heat ray expansion coefficient approximated to that of the ceramic board between a CBC substrate and the metal base. SOLUTION: At a semiconductor module for power, the thermal buffer board 9 is provided between the CBC substrate 2 and the metal base 1 with soldering. Metal approximated to the heat ray thermal expansion coefficient of the ceramic board, namely, molybdenum, tungsten, chromium and titanium are used as the thermal buffer board 9. Thus, the occurrence of thermal distortion is reduced between the ceramic board 3 and the thermal buffer board 9 and thermal stress occurred between the metal base 1 and the thermal buffer board 9 is absorbed by soft solder between the metal base 1 and the thermal buffer board 9. Thus, thermal stress is prevented from being added to the ceramic board which is mechanically weak at the time of use, and the ceramic board, namely, the CBC substrate 2 is prevented from being damaged.
Inventors:
YAMAMOTO TAKESHI
YAMAMOTO ATSUSHI
YAMAMOTO ATSUSHI
Application Number:
JP17888197A
Publication Date:
January 22, 1999
Filing Date:
June 19, 1997
Export Citation:
Assignee:
SANSHA ELECTRIC MFG CO LTD
International Classes:
H01L23/36; H01L23/48; H01L25/07; H01L25/18; H05K1/03; H05K1/05; H05K3/00; H05K3/34; (IPC1-7): H01L23/36; H01L23/48; H01L25/07; H01L25/18