Title:
SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2014116844
Kind Code:
A
Abstract:
To suppress an increase in size of a communication module including a semiconductor module adapted to a plurality of frequency bands.
A semiconductor module includes: a circuit board; a first semiconductor element substrate mounted on the circuit board and processing an input signal of a first frequency band; a second semiconductor element substrate mounted on the circuit board and processing an input signal of a second frequency band; and a control element board which is disposed between the first and second semiconductor element boards and mounted on the circuit board for controlling the first and second semiconductor element boards.
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Inventors:
MARUYAMA MASASHI
Application Number:
JP2012270540A
Publication Date:
June 26, 2014
Filing Date:
December 11, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H03F3/195; H01L25/07; H01L25/18; H03F3/24; H03F3/60; H03H7/38
Domestic Patent References:
JPH01140808U | 1989-09-27 | |||
JP2006148268A | 2006-06-08 | |||
JP2008035487A | 2008-02-14 | |||
JP2007174100A | 2007-07-05 | |||
JP2004281847A | 2004-10-07 | |||
JP2014512152A | 2014-05-19 | |||
JP2008135822A | 2008-06-12 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Mutsumi Sato
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Mutsumi Sato
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