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Title:
SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2014116844
Kind Code:
A
Abstract:

To suppress an increase in size of a communication module including a semiconductor module adapted to a plurality of frequency bands.

A semiconductor module includes: a circuit board; a first semiconductor element substrate mounted on the circuit board and processing an input signal of a first frequency band; a second semiconductor element substrate mounted on the circuit board and processing an input signal of a second frequency band; and a control element board which is disposed between the first and second semiconductor element boards and mounted on the circuit board for controlling the first and second semiconductor element boards.


Inventors:
MARUYAMA MASASHI
Application Number:
JP2012270540A
Publication Date:
June 26, 2014
Filing Date:
December 11, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H03F3/195; H01L25/07; H01L25/18; H03F3/24; H03F3/60; H03H7/38
Domestic Patent References:
JPH01140808U1989-09-27
JP2006148268A2006-06-08
JP2008035487A2008-02-14
JP2007174100A2007-07-05
JP2004281847A2004-10-07
JP2014512152A2014-05-19
JP2008135822A2008-06-12
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Mutsumi Sato