To provide a configuration such that a substrate reverse-surface side of a heat conduction member for conducting heat of a semiconductor chip to a heat sink etc., on a reverse side of the substrate is nearly in level with the reverse surface of a semiconductor mounting substrate having the heat conduction member.
The semiconductor mounting substrate where the heat conduction member (13) for conducting the heat of the semiconductor chip (12) to the substrate reverse side is fixed while inserted into a through hole (11a) formed in the substrate (11) and a heat dissipation means (15) is disposed on the reverse side of the heat conduction member (13) and substrate (11) is provided with a positioning means (15) for positioning the heat conduction member (13) in the through hole (11a) of the substrate (11) so that the reverse side thereof is nearly in level with the reverse surface of the substrate (11).
TANAKA MITSUHIRO
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura