To achieve the compact size and the thin configuration of a semiconductor package by connecting the electrode pad of a semiconductor chip and the electrode part of a package substrate corresponding to the pad to lead terminals respectively, and sealing the semiconductor chip with sealing resin.

A package substrate 2 is formed in the square frame shape in accordance with the outer shape of a semiconductor chip 3. The dimension in the frame is set larger than the dimension of the outer shape of the semiconductor chip 3 so that the semiconductor chip 3 can be contained in the frame. Then, a lead terminal 4 is bridged between the package substrate 2 and the semiconductor chip 3. One end of the terminal is connected to the electrode pad of the semiconductor chip 3 through a pump 7, and the other end is connected to an electrode part 6a of the package substrate 2 by a bonding material 8 comprising solder paste or the like. Sealing resin 5 is filled and sealed at the peripheral part of the semiconductor chip 3. Thus, the thickness of the package can be made thin, and the compact size and the thin configuration can be achieved.