To provide a small-sized semiconductor package that allows dissipating the heat generated in a semiconductor device further efficiently to the exterior without being affected even when soldering is implemented.
The semiconductor package 1 is provided with outer connection terminals 4 that are electrically connected to a semiconductor element 2 through electric connection sections 3; insulating layers 5 that coat in a thin film form the peripheries of the semiconductor element 2 and electrical connection sections 3 and also cover in a thin film form the peripheries of the outer connection terminals 4 at least near the electrical connection sections 3 to encapsulate the semiconductor element 2 in the interior; and a metal layer 6 provided to define a predetermined outer shape, while covering the peripheries of the insulating layers 5 to bury the insulating layers 5 in the interior, wherein the metal layer 6 is of a high melting-point metal material having a melting point higher than a low melting-point metal. A method of fabricating the semiconductor package 1 is also offered.
SAITO SHIGEO
| JPH05198694A | 1993-08-06 | |||
| JP2004537178A | 2004-12-09 | |||
| JPH0242499A | 1990-02-13 | |||
| JP2004297054A | 2004-10-21 | |||
| JP2004095607A | 2004-03-25 | |||
| JPH06275742A | 1994-09-30 | |||
| JPH03171652A | 1991-07-25 |
Tadashi Takahashi
Masakazu Aoyama
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