To provide a semiconductor package which has an IC chip mounted upright on a substrate and held in an upright mounted state without being laterally drawn by the surface tension of solder, and can be easily made short in height.
The semiconductor package 1A(1) includes at least an insulating substrate 11, a printed wiring board 10 arranged on one surface thereof and composed of wiring 12, and the IC chip 20 mounted to one surface side of the insulating substrate and having an integrated circuit 22 and re-wiring 24 on a principal surface. The insulating substrate has a cavity 13 which is opened on its one surface, the IC chip is put at least partially in the cavity and has the principal surface where the integrated circuit is disposed along an inner surface of the cavity, and the re-wiring of the IC chip and the wiring of the printed wiring board are electrically connected to each other through solder 14.
| JPS60263450 | INTEGRATED CIRCUIT PACKAGE |
| JP6495643 | Ceramic wiring board and electronic component mounting package |
| JP3394479 | SEMICONDUCTOR DEVICE |
| JP2007287947A | 2007-11-01 | |||
| JP2003197655A | 2003-07-11 | |||
| JP2008091774A | 2008-04-17 | |||
| JP2002198638A | 2002-07-12 |
Tadashi Takahashi
Takashi Watanabe
Next Patent: EPITAXIAL SILICON WAFER AND METHOD OF MANUFACTURING THE SAME