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Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE USING SAME
Document Type and Number:
Japanese Patent JPH0661289
Kind Code:
A
Abstract:

PURPOSE: To obtain a small semiconductor package that has a packaging area reduced by shortening the length of interconnections of a substrate and makes high speed processing possible, and to obtain a semiconductor module which uses this semiconductor package.

CONSTITUTION: Inner leads are formed on the surface of the inside from the outer peripheral surface of a semiconductor element 5 via an insulating tape 8. These inner leads are routed around to the vicinity of electrodes 9 arranged in two lines at the center of the semiconductor element 5. The inner leads and the electrodes 9 are connected with each other by fine metal wires, and the semiconductor element 5 is molded with a molding resin 1. Outer leads 4 are formed on one shorter side of a semiconductor package 1A.


Inventors:
Kawashita, Hiroshi
Michii, Kazunari
Application Number:
JP1992000211633
Publication Date:
March 04, 1994
Filing Date:
August 07, 1992
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/60; H01L23/495; H01L23/498; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
曾我 道照 (外6名)