Title:
SEMICONDUCTOR PACKAGE AND MOUNTING STRUCTURE THEREOF AND MOUNTING SOCKET THEREOF
Document Type and Number:
Japanese Patent JPH08288432
Kind Code:
A
Abstract:
PURPOSE: To remarkably improve heat radiating characteristic of a semiconductor package without resulting in cost-up by enlargement of package due to a heat radiating fin and forced air cooling.
CONSTITUTION: A package substrate 11 and a mother substrate is thermally coupled, during the package mounting, via a heat radiating block 16 by coupling a heat radiating block 16 to the lower surface of the package substrate 11 corresponding to the mounting position of a semiconductor chip 12 and designating the block surface 16b opposed to the coupling surface 16a as the coupling surface to the mother substrate.
Inventors:
MUNAKATA ICHIRO
USHINOHAMA IWAO
USHINOHAMA IWAO
Application Number:
JP8805595A
Publication Date:
November 01, 1996
Filing Date:
April 13, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L23/34; H01L23/32; H01L23/36; (IPC1-7): H01L23/36; H01L23/34
Attorney, Agent or Firm:
Kuninori Funabashi