Title:
SEMICONDUCTOR PACKAGE WITH BGA STRUCTURE OF CSP
Document Type and Number:
Japanese Patent JP3155741
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor package provided with the BGA(ball grid array) structure of a CSP(chip scaling package) which can be manufactured at a low cost through a simple manufacturing process.
SOLUTION: In a semiconductor package, a base 51 which has an openwork area in its intermediate section and a plurality of holes formed through the base 51 in a grid array-like state is brought into contact with lead terminals 52 of a lead frame, and the inner end sections of the terminals 52 are extended into the openwork area of the base 51. Then a die 53 is stuck and electrically connected to the inner end sections of the terminals 52, and the parts of the terminals 52 which are not in contact with the base 51 and the openwork area of the base 51 are covered with a molded sealing resin 55. Since the resin 50 does not flow in the holes of the base 51 in the molding process, solder balls 56 can be studded directly in the holes after molding.
Inventors:
Yellow building
Luo Yang
Luo Yang
Application Number:
JP35582598A
Publication Date:
April 16, 2001
Filing Date:
December 15, 1998
Export Citation:
Assignee:
Chi Product Precision Industry Co., Ltd.
International Classes:
H01L23/12; H01L21/56; H01L23/31; H01L23/495; H01L23/50; H01L25/10; H05K13/04; (IPC1-7): H01L23/12
Domestic Patent References:
| JP7321244A | ||||
| JP6268101A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)