To provide a semiconductor package which can be mounted on a packaging substrate with high reliability by reducing warpage caused by thermal stress.

The semiconductor package comprises a first interposer substrate 3 on which a first semiconductor chip 2 is disposed, a second interposer substrate 5 on which a second semiconductor chip 4 is disposed, a mold resin 7 which is charged between the interposer substrates and seals the first semiconductor chip and the second semiconductor chip, and a radiator plate 6. The first semiconductor chip and the second semiconductor chip are arranged so as to have line symmetry with respect to a center line L.