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Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2006294994
Kind Code:
A
Abstract:

To provide a semiconductor package having a high strength to a local external stress, and a low cost for a board packaging.

The semiconductor package of a tape type BGA package is composed of a glass cloth epoxy resin 8 adhering to the rear surface of a semiconductor chip 1 (the surface opposite to the surface with a bonding pad 2 of the semiconductor chip 1 formed thereon) by an adhesive agent 9, and of an epoxy resin 10 covering the peripheral part of the chip 1 and the resin 8.


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Inventors:
HANNAI SEIICHI
Application Number:
JP2005115993A
Publication Date:
October 26, 2006
Filing Date:
April 13, 2005
Export Citation:
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Assignee:
ELPIDA MEMORY INC
International Classes:
H01L23/12
Attorney, Agent or Firm:
Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata



 
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