PURPOSE: To simplify the adjustment of an optical system into which a solid- state image sensor and the like are built, by making the surface of a lead frame obtaining electric continuity with the outside the die attaching surface, exposing at least a part of the rear of the die attaching surface to the outside, and making the exposed surface a reference surface at the time of attaching the semiconductor chip.

CONSTITUTION: The surface 10d of a die pad 10c of a lead frame 10 is used as a die attaching surface, on which a semiconductor chip 2 is diebonded. Electrodes of the semiconductor chip 2 and the inner leads 10a of the lead frame 10 are electrically connected by using bonding wires 4. The upper part of a sealing frame 9 is hermetically sealed by a window glass 7 while a sealing member 6 is interposed. Thereby a part of the rear 10e of the die pad 10c of the lead frame 10 is constituted so as to be exposed to the outside through a penetrating hole 8b formed in a ceramic substrate 8, and the exposed surface is set as the reference surface at the time of attaching the semiconductor chip.