Title:
SEMICONDUCTOR PACKAGE METHOD AND SEMICONDUCTOR PACKAGE STRUCTURE
Document Type and Number:
Japanese Patent JP2022027447
Kind Code:
A
Abstract:
To provide a semiconductor package method and a semiconductor package structure.SOLUTION: A semiconductor package method according to the present invention includes the steps of: setting a plurality of semiconductor devices 120 on a carrier 110; forming a sealing body 130, which covers the semiconductor devices 120 and includes a groove part 131, on the carrier 110, the groove part 131 having a strengthening part 131a and a concave part 131b, the strengthening part 131a protruding from the concave part 131b, the sealing body 130 surrounding the concave part 131b; and removing the strengthening part 131a of the groove part 131 of the sealing body 130.SELECTED DRAWING: Figure 1C
Inventors:
KUO CHIH-MING
HO LUNG-HUA
HSU YOU MING
WU FEI-JAIN
HO LUNG-HUA
HSU YOU MING
WU FEI-JAIN
Application Number:
JP2021069248A
Publication Date:
February 10, 2022
Filing Date:
April 15, 2021
Export Citation:
Assignee:
CHIPBOND TECH CORP
International Classes:
H01L23/29; H01L23/12
Domestic Patent References:
| JP2017005009A | 2017-01-05 |
Foreign References:
| US20130295720A1 | 2013-11-07 | |||
| US9576931B1 | 2017-02-21 |
Attorney, Agent or Firm:
Patent Business Corporation Hattori International Patent Office
Hattori Masaki
Hattori Masaki
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