PURPOSE: To make a used pad and an unused pad inside a chip discriminable at a glance for sharply reducing errors at the time of connecting a pin and a pad with a wire, by providing the unused pad with a mark.

CONSTITUTION: The information on a mark of an unused pad is incorporated in a pad part of mask data so as to make a mask. Next, at the time of making a chip, aluminium on the mark part of the unused pad is removed by an etching method for partially exposing a semiconductor substrate. Thereby, the difference between the used pad 102 and the unused pad 103 is obvious, and due to performed etching it can be so made that a connection wire 104 may stick to an unmarked used pad but the connection wire 104 may be hard to stick to an unused pad whose marked part is erased.