Title:
SEMICONDUCTOR PART
Document Type and Number:
Japanese Patent JPH06151650
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor part, which can be removed easily and in which the reliability test on the bare chip can be performed and besides the mounting are of which can be made small, concerning the semiconductor part mounted on the surface of a printed board.
CONSTITUTION: This semiconductor part has a bare chip 1, resin 2 to coat bare chip 1 at large, and a bump 3 which is connected electrically to the bare chip 1, being partially projecting from the resin 2.
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Inventors:
NAKAMURA NAOKI
Application Number:
JP29871492A
Publication Date:
May 31, 1994
Filing Date:
November 09, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/60; H01L23/02; H01L23/12; H01L23/28; (IPC1-7): H01L23/28; H01L21/60; H01L23/02
Attorney, Agent or Firm:
Masao Yamakawa