Title:
SEMICONDUCTOR POLISHER, METHOD OF DETECTING SEMICONDUCTOR POLISHING END POINT AND METHOD OF DETECTING DRESSING END POINT OF POLISHER HEAD
Document Type and Number:
Japanese Patent JP2003086551
Kind Code:
A
Abstract:
To provide an improved method of exactly detecting the end points of polishing and dressing processes for improving the throughput and the stability of the overall polishing process.
The semiconductor polisher for polishing a wafer 4 held with a polisher head 5 so that the wafer 4 is contracted by specified pressure to a polishing pad 3 adhered to a polishing table 1 comprises a dresser 9 set facing the polishing pad 3 for dressing the polishing pad 3 and an acoustic sensor 11a for detecting sounds generated by the friction of the head 5 with the wafer 4.
Inventors:
FUJII KAZUYUKI
Application Number:
JP2001271675A
Publication Date:
March 20, 2003
Filing Date:
September 07, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B24B37/013; B24B49/02; B24B49/10; B24B49/18; B24B53/00; B24B53/017; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B37/04; B24B49/10; B24B49/18; B24B53/00
Attorney, Agent or Firm:
Hisami Fukami (4 outside)