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Patent Searching and Data


Title:
SEMICONDUCTOR POWER MODULE
Document Type and Number:
Japanese Patent JP2005183776
Kind Code:
A
Abstract:

To provide a semiconductor power module which enables a magnetic member used as a filter element to be exchanged as required and enables the miniaturization of a package.

The semiconductor power module is formed by improving a semiconductor power module for a power conversion device which carries out the power conversion of DC power and AC power by switching a power semiconductor element such as an IGBT. An annular magnetic member 6c is disposed to enclose terminals such as terminals 2a, 2b connected to the power semiconductor element inside the module package 21. Consequently, a noise current flowing in the terminals 2a, 2b accompanied by the switching of the power semiconductor element is effectively restrained.


Inventors:
TAKUBO HIROSHI
Application Number:
JP2003424421A
Publication Date:
July 07, 2005
Filing Date:
December 22, 2003
Export Citation:
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Assignee:
FUJI ELEC DEVICE TECH CO LTD
International Classes:
H01F17/06; H01L25/00; H01L25/07; H01L25/18; H01L29/76; H03H1/00; (IPC1-7): H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yuichi Morita