To provide a semiconductor pressure sensor which is small, whose structure is simple, which can be manufactured easily, which is low-cost whose pressure-resistant strength is excellent and which is operated stably for a long period and to provide its manufacturing method.

A semiconductor pressure sensor is constituted of a cylindrical housing 1, a ceramic pedestal 4 which is placed on the housing and which is provided with pin insertion and passage holes 3, a semiconductor pressure sensor element 7 which is fixed to the ceramic pedestal, lead pins 5 which are passed through the pin insertion and passage holes and which are connected to the semiconductor pressure sensor element by lead wires 8 and an epoxy resin which fills a gap between the ceramic pedestal and the inner circumference of the housing and gaps between the pin insertion and passage holes and the lead pins. In this case, the epoxy resin is filled into the gaps between the pin insertion and passage holes and the lead pins and the gap between the ceramic pedestal and the inner circumference of the housing. The semiconductor pressure sensor element is fixed onto the ceramic pedestal. Tips of the lead pins are connected by the lead wires. Thereby, the semiconductor pressure sensor is manufactured.