To prevent penetration of air and moisture into a resin case and bubble generation inside a coating resin layer to improve operating environment resistance and reliability.

In this semiconductor sensor, a pressure-sensitive sensor chip 1 formed with a semiconductor distortion gauge is installed inside the resin case 3 insert-molded with lead terminals 4, the lead terminals 4 are connected to the sensor chip 1 with bonding wires 5, and a soft gelatinous coating resin 6 is filled in the resin case 3 to seal around the sensor chip 1 and the bonding wires 5. Case penetration areas of the lead terminals 4 including bonded parts between the lead terminals 4 and the bonding wires 5 are coated with a sealing resin 8 of an adhesive or a gel having a relatively high hardness, and the soft gelatinous coating resin 6 having waterproofness and chemical resistance is filled in the residual area of the resin case 3 to coat the pressure-sensitive sensor chip 1 and the bonding wires 5.