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Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP04072772
Kind Code:
A
Abstract:

PURPOSE: To enable a single kind of sensor chip to deal with different pressures to measure by a method wherein gauge resistors which form at least two sets of Wheastone bridge circuits are arranged on the surface of the pressure sensing diaphragm of a sensor chip.

CONSTITUTION: First resistors R11-R14 which form a first Wheastone bridge circuit and second resistors R21-R24 which constitute a second Wheastone bridge circuit are disposed on the surface of the pressure sensing diaphragm SD of a sensor chip SC. The first resistors R11-R14 are connected to first bonding pads BP11-BP14 through the intermediary of first wires WR11-WR14 respectively, and the second resistors R21-R24 are connected to first bonding pads BP21-BP24 through the intermediary of first wires WR21-WR24. respectively.


Inventors:
Mizuno, Tomohiro
Application Number:
JP1990000186195
Publication Date:
March 06, 1992
Filing Date:
July 13, 1990
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01L9/04; G01L9/00; H01L29/84; G01L9/04; G01L9/00; H01L29/66; (IPC1-7): G01L9/04; H01L29/84



 
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