To provide a semiconductor pressure sensor high in yield in wire bonding and high in reliability in its joint.

A semiconductor sensor chip is housed in a body 10. A metal mold 20 to mold the body 10 and a lead 15 simultaneously is provided with a protruded part 21 for forming an opening in the body 10. In the shoulder part 21a of the protruded part 21, a recessed part 21b is formed at the section corresponding to the center part of the main surface of a wire terminal part 16, which is one end part of the lead 15, and the shoulder part 21a is in close contact only with the peripheral part of the main surface of the wire terminal part 16. In other words, at the time of simultaneous molding, the center part 16a of the wire terminal part 16 does not come into contact with the shoulder part 21a of the protruded part 21. Here, the shoulder part 21a constitutes a pressing part. The center part of the main surface of the wire terminal part 16 is used as an effective area of wire bonding, and a bonding wire is connected to the effective area.