Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3285971
Kind Code:
B
Abstract:
PURPOSE: To enable manufacture of an absolute pressure sensor by using an ordinary gauge pressure sensor package.
CONSTITUTION: The device is provided with a package 20 with a pressure medium introduction hole 10, a pedestal 2 which has a groove 22 communicated with the pressure medium introduction hole and is mounted inside a package, a semiconductor pressure sensor chip 3 which is mounted on an upper surface of the pedestal and forms a vacuum chamber 6 at the pedestal side and a lid 21 which blocks an assembly opening of the package and forms a blocked space for introducing pressure medium to an opposite side of the vacuum chamber of the sensor chip.
Inventors:
Kawahira, Tetsuya
Application Number:
JP1992000319509
Publication Date:
March 08, 2002
Filing Date:
November 04, 1992
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
G01L19/00; G01L9/00; H01L29/84; G01L19/00; G01L9/00; H01L29/66; (IPC1-7): H01L29/84; G01L19/00