Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JPH04353732
Kind Code:
A
Abstract:
PURPOSE:To obtain a pressure sensor which can detect the pressure of corrosive fluid. CONSTITUTION:The front part of a thin-film-shaped pressure sensitive element 9 which is provided in a housing 25 is partitioned with a sealing diaphragm 28 made of a resin having excellent corrosion resistance. A pressure medium 30 is filled in a sealed space formed between the pressure sensitive element 9 and the sealing diaphragm 28. Therefore, when corrosive fluid flows in, the shape of the pressure sensitive element 9 is changed with the pressure through the sealing diaphragm 28 and the pressure medium 30, and the pressure of the fluid can be measured. The sealing diaphragms 28 is attached to the housing by ultrasonic welding.
Inventors:
ABE ARIMASA
Application Number:
JP12918191A
Publication Date:
December 08, 1992
Filing Date:
May 31, 1991
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
G01L9/04; G01L9/00; (IPC1-7): G01L9/04
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)