Title:
SEMICONDUCTOR PROCESS LIQUID AND PROCESSING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2015018957
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor process liquid and a peeling method, which are excellent in peelability of a resin layer such as a photoresist layer formed on a silicon substrate, or which combine an anticorrosion effect on a substrate constituent member including metal and substrate member itself.SOLUTION: In a processing method using a semiconductor process liquid, a resin composition on a silicon substrate is peeled by using a semiconductor process liquid which includes an organic alkaline compound, and a nonionic surface-active agent which has a hydrophobic structure in a main skeleton and a hydrophilic group in a side chain, in which the hydrophilic group has a pyrolidone structure.
Inventors:
KASHIMURA TAKASHI
YAMAGUCHI YOSHIHIDE
YAMAGUCHI YOSHIHIDE
Application Number:
JP2013145562A
Publication Date:
January 29, 2015
Filing Date:
July 11, 2013
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
H05K3/34; C11D7/22; C11D7/32; C11D17/08; G03F7/42; H01L21/027; H01L21/304
Attorney, Agent or Firm:
青稜 patent business corporation
Polaire Intellectual Property Corporation
Polaire Intellectual Property Corporation
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