Title:
半導体保護回路装置
Document Type and Number:
Japanese Patent JP5157091
Kind Code:
B2
Inventors:
Akira Miyamoto
Application Number:
JP2006173647A
Publication Date:
March 06, 2013
Filing Date:
June 23, 2006
Export Citation:
Assignee:
Jvc kenwood corporation
International Classes:
H02H5/04; H02H3/087
Domestic Patent References:
| JP4038119U | ||||
| JP2001274634A |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune