Title:
SEMICONDUCTOR RADIATION EMITTER PACKAGE
Document Type and Number:
Japanese Patent JP2005005740
Kind Code:
A
Abstract:
To provide a semiconductor radiation emitter package which combines a high emission amount of an output and protection from heat.
The semiconductor radiation emitter package 200 includes a lead frame 201, a semiconductor radiation emitter 202, and an encapsulant 203. The lead frame 201 supports the semiconductor radiation emitter 202, and includes a heat-absorbing member 204 for providing a heat path which removes heat generated in the emitter 202 into a surrounding environment, and at least two electrical leads 205 for electrically being connected to the semiconductor radiation emitter 202. The encapsulant 203 covers the emitter 202 and a selective line junction 211, and protects them from damage.
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Inventors:
ROBERTS JOHN K
STAM JOSEPH S
REESE SPENCER D
TURNBULL ROBERT R
STAM JOSEPH S
REESE SPENCER D
TURNBULL ROBERT R
Application Number:
JP2004273409A
Publication Date:
January 06, 2005
Filing Date:
September 21, 2004
Export Citation:
Assignee:
GENTEX CORP
International Classes:
H01L23/28; B60Q1/26; H01L23/36; H01L23/495; H01L23/50; H01L33/50; H01L33/54; H01L33/62; H01L33/64; H01L51/52; (IPC1-7): H01L33/00
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroyuki Uchida
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroyuki Uchida