PURPOSE: To enable a package to be formed without voids, by providing molds with discharge paths communicated with the inside of cavities and a pot, and evacuating the pot and the cavities before pressurizing resin material.
CONSTITUTION: Synthetic resin 14 in a pot 10 is pressurized by a plunger 11 during clamping of molds, so that cavities 6 and 7 are filled with the synthetic resin to mold a package 5. Before the plunger 11 pressurizes the resin within the pot 10, an air suction device (not shown) is driven to discharge air present within the pot 10 and the cavities 6, 7 out of the molds 1 through discharge paths 25, 26 and tubes 27, 28 for establishing a vacuum within the pot 10 and the cavities 6, 7. Thereby, the air within the pot 10 and the cavities 6, 7 can be effectively prevented from entering into the synthetic resin 14, and no void is formed on the surfaces of the package 5 or in the package during the pressurization of the resin.
MORITA YUTAKA
TANAKA SUEKICHI
