To provide a semiconductor resin sealing device which has a clamping force of high accuracy and/or controls a position of a metal mold with high accuracy.

A device 2 comprises a pair of metal molds for sealing a semiconductor chip with resin by placing the semiconductor chip in a cavity and injecting the resin into the cavity while clamping, a servo motor 20 that drives the clamping/opening operation of the metal mold, a controller 18 that controls a motor, an encoder 24 that detects the rotation angle of the motor, and a load cell 16 that detects the clamping force of the metal mold. The controller compares/calculates a detected value of the load cell and a target clamping force during the clamping operation, and then controls the motor based on the result of the calculation, and then, in a region for an operation other then the clamping operation, controls the motor based on a detected value of the encoder. While die-opening, the position of the metal mold is controlled while the semiconductor chip, etc., is taken in/out of a region between a pair of metal molds. A relative position of the metal mold for the position of a transport mechanism is specified with a high degree of accuracy, so that taking in/out is surely performed.